? semiconductor components industries, llc, 2012 january, 2012 ? rev. 1 1 publication order number: NCP4545/d NCP4545 ecoswitch advanced load management controlled load switch with low r on the NCP4545 load switch provides a component and area-reducing solution for efficient power domain switching with inrush current limit via soft start. it is designed to integrate control and driver functionality with a high performance low on-resistance power mosfet in a single device. this cost effective solution is ideal for power management and hot ? swap applications requiring low power consumption in a small footprint. features ? advanced controller with charge pump ? integrated n ? channel mosfet ? soft ? start via adjustable slew rate control ? low on ? resistance ? input voltage range 0.5 v to 6 v ? low standby current ? load bleed function ? no external components required ? enable pin with cmos input levels ? this is a pb ? free device typical applications ? notebook and tablet computers ? handheld electronics ? digital cameras ? portable medical devices ? hard drives ? peripheral ports figure 1. typical application ? no external components included bandgap & biases charge pump rc oscillator delay and slew rate control controller 0.5 v ? 6 v load v cc en v in delay sr gnd bleed v out 3 v ? 5.5 v qfn18, 3x3 case 485bf marking diagram 1 ncp 4545x alyw 1 x = blank for en active ? high = l for en active ? low a = assembly location l = wafer lot y = year w = work week = pb ? free package http://onsemi.com r on typ v cc i max 4.7 m 5.0 v 10.5 a 3.3 v 5.9 m v in 1.8 v 5.0 v pin configuration (top view) 19: v in 1 13 17 18 16 15 14 12 11 2 3 4 10 v in v in v out v out v out delay v in v in en bleed sr v in gnd v cc v in v in v in 5 6 7 8 9 v in see detailed ordering and shipping information on page 4 of this data sheet. ordering information
NCP4545 http://onsemi.com 2 pin description pin name function 1 delay turn ? on delay adjustment 2 v cc supply voltage to controller (3.0 v ? 5.5 v) 3 gnd controller ground 4, 5, 9 ? 14, 18, 19 v in drain of mosfet (0.5 v ? 6.0 v) 6 ? 8 v out source of mosfet connected to load 15 bleed load bleed connection 16 en NCP4545imntwg ? active ? high digital input used to turn on the mosfet, pin has an internal pull down resistor to gnd NCP4545imntwg ? l ? active ? low digital input used to turn on the mosfet, pin has an internal pull up resistor to v cc 17 sr slew rate adjustment absolute maximum ratings rating symbol value unit supply voltage range v cc ? 0.3 to 6 v input voltage range v in ? 0.3 to 6 v output voltage range v out ? 0.3 to 6 v en digital input range v en ? 0.3 to (v cc + 0.3) v thermal resistance, junction ? to ? air (note 1) r ja 49.9 c/w thermal resistance, junction ? to ? air (note 2) r ja 32.8 c/w thermal resistance, junction ? to ? case (v in paddle) r jc 3.3 c/w continuous mosfet current (note 3) i max 10.5 a total power dissipation @ t a = 25 c (notes 1 and 4) derate above t a = 25 c p d 1.30 20.1 w mw/ c total power dissipation @ t a = 25 c (notes 2 and 4) derate above t a = 25 c p d 1.98 30.5 w mw/ c storage temperature range t stg ? 40 to 150 c lead temperature, soldering (10 sec.) t sld 260 c esd capability, human body model (notes 5 and 6) esd hbm 4.0 kv esd capability, machine model (note 5) esd mm 200 v esd capability, charged device model (note 5) esd cdm 1 kv latch ? up current immunity (note 5) lu 100 ma stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. surface ? mounted on fr4 board using the minimum recommended pad size, 1 oz cu. 2. surface ? mounted on fr4 board using 1 sq ? in pad, 1 oz cu. 3. current limited by package. 4. specified for derating purposes only, ensure that i max is never exceeded. 5. tested by the following methods @ t a = 25 c: esd human body model tested per aec ? q100 ? 002 (eia/jesd22 ? a114) esd machine model tested per eia/jesd22 ? a115 esd charged device model per eia/jesd22 ? c101 latch ? up current maximum rating: 100 ma per jedec standard: jesd78 6. rating is for all pins except for v in and v out which are tied to the internal mosfet?s drain and source. t ypical mosfet esd performance for v in and v out should be expected and these devices should be treated as esd sensitive.
NCP4545 http://onsemi.com 3 operating ranges rating symbol min max unit supply voltage v cc 3 5.5 v input voltage v in 0.5 6 v ground gnd 0 v ambient temperature t a 0 70 c junction temperature t j 0 90 c electrical characteristics (t j = 25 c unless otherwise specified) parameter conditions (note 7) symbol min typ max unit mosfet on ? resistance v cc = 5.0 v; v in = 1.8 v r on 4.7 5.9 m v cc = 5.0 v; v in = 5.0 v 4.9 6.1 v cc = 3.3 v; v in = 1.8 v 5.0 6.7 v cc = 3.3 v; v in = 5.0 v 5.9 7.0 leakage current (note 8) v en = 0 v; v in = 6 v i leak 0.025 1.0 a controller supply standby current (note 9) v en = 0v; v cc = 5.5 v i stby 5.0 15 a supply dynamic current (note 10) v en = v cc = 5.5 v i dyn 250 500 a bleed resistance r bleed 50 100 200 en input high voltage v ih 2.0 v en input low voltage v il 0.8 v en pull down resistance NCP4545imntwg r pd 40 100 180 k en pull up resistance NCP4545imntwg ? l r pu 40 100 180 k 7. v en shown only for NCP4545imntwg (en active ? high). 8. average current from v in to v out with mosfet turned off. 9. average current from v cc to gnd with mosfet turned off. 10. average current from v cc to gnd after charge up time of mosfet.
NCP4545 http://onsemi.com 4 switching characteristics (t j = 25 c unless otherwise specified, note 11) parameter conditions symbol min typ max unit v cc = 5.0 v, v in = 1.8 v output slew rate (note 12) r l = 10 , c l = 0.1 f sr 8.4 kv/s output turn ? on delay (note 12) r l = 10 , c l = 0.1 f t on 525 s output turn ? off delay r l = 10 , c l = 0.1 f t off 2.0 s v cc = 3.3 v, v in = 5.0 v output slew rate (note 12) r l = 10 , c l = 0.1 f sr 3.7 kv/s output turn ? on delay (note 12) r l = 10 , c l = 0.1 f t on 930 s output turn ? off delay r l = 10 , c l = 0.1 f t off 1.1 s 11. see below figure for test circuit and timing diagrams. 12. see applications information below for details on how to adjust this parameter. en NCP4545 delay sr gnd bleed off on 10% 90% sr = v v en 50% 50% 10% 90% figure 2. test circuit and timing diagrams v out t on t off v out t t v v in v cc v out r l c l ordering information device en polarity package shipping ? NCP4545imntwg active ? high qfn18 (pb ? free) 3000 / tape & reel NCP4545imntwg ? l active ? low ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
NCP4545 http://onsemi.com 5 typical characteristics figure 3. on ? resistance vs. input voltage v in , input voltage (v) r on , on ? resistance (m ) v cc = 3 v v cc = 3.3 v v cc = 4 v v cc 4.5 v v in = 6 v v in = 5 v v in = 3.3 v v in = 1.8 v v in = 0.5 v figure 4. on ? resistance vs. supply voltage v cc , supply voltage (v) r on , on ? resistance (m ) figure 5. on ? resistance vs. temperature t j , junction temperature ( c) r on , on ? resistance (m ) v in = 6 v v cc = 3 v v in = 5 v v cc = 3.3 v v in = 1.8 v v cc = 5 v figure 6. slew rate vs. input voltage 4.5 4.75 5.0 5.25 5.5 5.75 6.0 6.25 6.5 6.75 7.0 7.25 7.5 4 4.5 5 5.5 6 6.5 7 7.5 8 8.5 9.5 4.5 4.75 5.0 5.25 5.5 5.75 6.0 6.25 6.5 6.75 7.0 7.25 7.5 figure 7. slew rate vs. supply voltage figure 8. slew rate vs. temperature v in , input voltage (v) sr, slew rate (kv/s) v cc = 3 v v cc = 5.5 v 1 2 3 4 5 6 7 8 9 v in = 6 v v in = 0.5 v v cc , supply voltage (v) sr, slew rate (kv/s) 1 2 3 4 5 6 7 8 9 t j , junction temperature ( c) sr, slew rate (kv/s) v cc = 3.3 v v in = 5 v v cc = 5 v v in = 1.8 v 3 4 5 6 7 8 9 10 010203040506070 90 80 0.5 1 1.5 2 2.5 3 3.5 4 6 4.5 5 5.5 0.5 1 1.5 2 2.5 3 3.5 4 6 4.5 5 5.5 3 3.5 4 4.5 5 5.5 010203040506070 90 80 3 3.5 4 4.5 5 5.5 9
NCP4545 http://onsemi.com 6 typical characteristics figure 9. turn ? on delay vs. input voltage figure 10. turn ? on delay vs. supply voltage figure 11. turn ? on delay vs. temperature t on , turn ? on delay ( s) figure 12. turn ? off delay vs. input voltage t j , junction temperature ( c) 500 600 700 800 900 1000 400 figure 13. turn ? off delay vs. supply voltage figure 14. turn ? off delay vs. temperature v in , input voltage (v) t on , turn ? on delay ( s) v cc = 3 v v cc = 5.5 v 500 600 700 800 900 1000 1100 1200 400 v in = 6 v v in = 0.5 v v cc , supply voltage (v) t on , turn ? on delay ( s) 400 500 600 700 800 900 1000 1100 v cc = 3.3 v v in = 5 v v cc = 5 v v in = 1.8 v v in , input voltage (v) t off , turn ? off delay ( s) v cc = 3 v v cc = 5.5 v 0.5 1 1.5 2 2.5 3 v in = 6 v v in = 0.5 v v cc , supply voltage (v) t off , turn ? off delay ( s) 0.75 1 1.25 1.5 1.75 2 2.25 2.5 2.75 3 t off , turn ? off delay ( s) t j , junction temperature ( c) 0.5 0.75 1 1.25 1.5 1.75 2 2.25 v cc = 3.3 v v in = 5 v v cc = 5 v v in = 1.8 v 0.5 1 1.5 2 2.5 3 3.5 4 6 4.5 5 5.5 3 3.5 4 4.5 5 5.5 0.5 1 1.5 2 2.5 3 3.5 4 6 4.5 5 5.5 3 3.5 4 4.5 5 5.5 010203040506070 90 80 010203040506070 9 0 80
NCP4545 http://onsemi.com 7 typical characteristics figure 15. mosfet leakage current vs. temperature figure 16. bleed resistance vs. temperature figure 17. standby current vs. supply voltage figure 18. standby current vs. temperature i leak , mosfet leakage current (na) t j , junction temperature ( c) 20 30 40 50 60 70 80 90 100 r bleed , bleed resistance ( ) t j , junction temperature ( c) 95 100 105 110 115 120 125 130 figure 19. turn ? on response (v cc = 3.3 v, v in = 5.0 v, r l = 10 , c l = 0.1 f) figure 20. turn ? off response (v cc = 3.3 v, v in = 5.0 v, r l = 10 , c l = 0.1 f) i stby , standby current ( a) v cc , supply voltage (v) 1.5 2 2.5 3 3.5 4 4.5 5 5.5 1 i stby , standby current ( a) t j , junction temperature ( c) 4.5 4.75 5 5.25 5.5 5.75 6 4 4.25 010203040506070 90 80 0 10 20 30 40 50 60 70 90 80 010203040506070 90 80 3 3.5 4 4.5 5 5.5
NCP4545 http://onsemi.com 8 applications information on ? resistance the mosfet gate voltage in the NCP4545 is driven by a charge pump in the controller circuit. the output voltage of the charge pump is dependent on the voltage on v cc . the r on of the mosfet is in turn dependent on its v gs . care must be taken to ensure a sufficient v cc voltage is used to create the desired r on given the anticipated input voltage. enable control the NCP4545 has two separate part numbers, NCP4545imntwg and NCP4545imntwg-l, that only differ in the polarity of the enable control. the NCP4545imntwg allows for enabling the mosfet in an active-high configuration. when the en pin is at a logic high level and the v cc supply pin has an adequate voltage applied, the mosfet will be enabled. similarly, when the en pin is at a logic low level, the mosfet will be disabled. an internal pull down resistor to gnd on the en pin ensures that the mosfet will be disabled when not being driven. the NCP4545imntwg-l allows for enabling the mosfet in an active-low configuration. when the en pin is at a logic low level and the v cc supply pin has an adequate voltage applied, the mosfet will be enabled. similarly, when the en pin is at a logic high level, the mosfet will be disabled. an internal pull up resistor to v cc on the en pin ensures that the mosfet will be disabled when not being driven. parametric adjustments the NCP4545 can be used in several configurations depending on the need to control turn-on delay, slew rate, and bleed resistance. default values of each parameter are built into the part without the requirement of external components. this configuration is shown above in figure 1. figures 21 and 22 show alternate configurations where external components are used to modify the turn-on delay, slew rate, and total bleed resistance. figure 21 shows an external capacitor, c combo , connected from the v out pin to both the delay and sr pins. this allows for one external capacitor to be used to modify the turn-on delay and slew rate. note that the value of c combo is used in equations 1 and 2 (below) in place of c del and c sr respectively. figure 22 shows the use of two external capacitors for independent control of the turn-on delay and slew rate. turn ? on delay the NCP4545 provides a time delay between the input transition on en to the mosfet turning on. the turn-on delay can be increased with an external capacitor added between the delay pin and either ground or the v out pin as shown in figures 21 and 22. the total delay is calculated by adding the default turn-on delay to a delta term which is calculated as follows: t k del *c del (eq. 1) where k del is a constant and c del is the off-chip capacitance added between the delay pin to either ground or the v out pin (see table below). when no external capacitor is present, the delay will be the specified default turn-on delay. slew rate control the NCP4545 is equipped with controlled output slew rate which provides soft start functionality. this limits the inrush current caused by capacitor charging and enables this device to be used in hot swapping applications. the slew rate can be decreased with an external capacitor added between the sr pin and the v out pin as shown in figures 21 and 22. the slew rate can be calculated as follows: sr k sr c sr c chip (eq. 2) where k sr is a constant, c sr is the off-chip capacitance added between the sr pin and the v out pin, and c chip is the on-chip capacitance (see table below). note that this equation is only valid for c sr 470 pf. when no external capacitor is present, the slew rate will be the specified default slew rate. load bleed the NCP4545 has an on ? chip bleed resistor that can be used to bleed the charge off of the load to ground after the mosfet has been disabled. in series with the bleed resistor is a bleed switch which is enabled whenever the mosfet is disabled. delays are added to the enable of this switch to ensure that both the mosfet and the bleed switch are not concurrently active. the total bleed resistance can be increased by adding a resistor between the bleed pin and the v out pin as shown in figures 21 and 22. if the load bleed function is not desired, the bleed pin should be tied to ground or left floating. slew rate and turn ? on delay parameter conditions symbol min typ max unit turn ? on delay constant k del 1.77 m external delay capacitance (note 13) between del pin and gnd c del 10 nf slew rate constant k sr 1.42 a external slew rate capacitance (note 13) between sr pin and v out pin c sr 2 nf internal slew rate capacitance c chip 150 pf external combo capacitance (note 13) between sr & del pins and v out pin c combo 2 nf 13. recommended range, larger values may be used but may degrade the performance of the part
NCP4545 http://onsemi.com 9 figure 21. example application ? external bleed resistor with single ? capacitor adjustment of turn ? on delay and slew rate. bandgap & biases charge pump rc oscillator delay and slew rate control load delay sr gnd bleed 0.5 v ? 6 v c combo r b en controller v cc v in v out 3 v ? 5.5 v figure 22. example application ? external bleed resistor with independent adjustment of turn ? on delay and slew rate. en bandgap & biases charge pump rc oscillator delay and slew rate control load delay sr gnd bleed controller c del c sr r b v cc v in v out 0.5 v ? 6 v 3 v ? 5.5 v
NCP4545 http://onsemi.com 10 package dimensions qfn18, 3x3, 0.5p case 485bf issue o ??? ??? ??? ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. recommended pin 1 reference a b c 0.15 top view d e c 0.15 notes: 1. dimensions and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from terminal. 4. coplanarity applies to the exposed pad as well as the terminals. e2 bottom view b 0.10 18x l 1 5 0.05 c ab c d2 e k 4 13 18x (a3) c c 0.08 c 0.10 side view a1 a seating plane dim min max millimeters a 0.80 1.00 a1 0.00 0.05 a3 0.20 ref b 0.18 0.30 d 3.00 bsc d2 1.75 1.95 e 3.00 bsc e2 1.75 1.95 e 0.50 bsc k 0.20 ??? l 0.275 0.375 note 3 l1 detail a 0.00 0.15 note 4 detail b 3.30 18x dimension: millimeters 0.53 1.95 1.95 0.50 pitch 18x 0.31 mounting footprint detail a 3.30 l 9 10 18 package outline on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any pa rticular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?t ypicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license un der its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended f or surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in a ny manner. NCP4545/d ecoswitch is a trademark of semiconductor components industries, llc (scillc). publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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